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SynChem – Resins & Varnishes

Damisol® 3630 HTP 01/300 1-component-resin

Damisol® 3630 HTP 01/100 is an opaque, solvent-free 1-component-resin based on unsaturated polyesterimides.

Attributes

The thixotrop Damisol® 3630 HTP 01/100 has the following properties:

  • no VOC (Volatile Oganic Compound)
  • very low smell
  • high reactivity
  • high stability in tank
  • low viscosity

Cured Damisol® 3630 HTP 01/100 has the following properties:

  •  outstanding thermal resistance up to (and more than) Class H.
Application

Damisol® 3630 HTP 01/100 is suitable for 3.3. kV machines using right porous mica polyester film based tape as main wall insulation, like Samicapor 315.45. Dipping, VPI, trickling and Roll-Dipping of all kinds of windings, from any low and medium voltage machines and transformers.

Standards
  • UL-approved Class 180 (H)
  • UL-File-no. E 98511
  • RoHS-compliant acc. 2011/65/EU
  • VOC-free, 1999/13/EC
Delivery forms

Damisol® 3630 HTP 01/100 is available in:

  •  20 kg cans
  • 200 kg drums
  • 1000 kg container
Storage

Damisol® 3630 HTP 01/100 can be stored 12 months at max. 25 °C in sealed containers and must be protected from light and sun. Higher temperature can be reached during short period of time. If storing the resin in a supply tank, it is recommended keeping the resin under atmospheric pressure.

Hardening

Recommended curing time:

  • Trickling: at 150 °C - 30-60 min.
  • Dipping and VPI: at 150 °C - 2 h
Protection

Please refer to the material safety data sheet for complete information.

Processing

The Damisol® 3630 HTP 01/100 can be precessed in any kind of dipping, VPI; trickling or Dip-Rolling machines, in immersion and vacuum or vacuum pressure installations. If storing the resin in a supply tank, we recommend keeping the resin under atmospheric pressure. It is advantageous not to fill the supply tank completely. The recommended filling level is 70 %.
Using hot impregnating process, the resin temperature should be maintainedlower than 30 °C and refreshed with new resin.

Technical data
Mechanical
Bond strength  Bond strength  Bond strength 
Unit of measure Conditions  Value  Test method 
daN  23 °C 25 IEC 61033
daN  155 °C 8 IEC 61033
daN  180 °C 6 IEC 61033
Thermal
Thermal class 
Unit of measure Value 
°C  180
Chemical
Resistance  Resistance 
Unit of measure Conditions  Value  Test method 
2 % sodium hydroxide <0.5 ISO 175
10 % hydrogen chloride <0.7 ISO 175
Liquid phase
Flashpoint  Gel time at 120 °C  Density  Viscosity 
Unit of measure Conditions  Value  Test method 
°C    >100 ISO 3679
min    3-6  
g/cm³  at 23 °C 1.10  
mPas  23 °C / 2.5 rpm 250-350 Brookfield/ISO 2555
Electrical
Dielectric strength at 23 °C and 50 % r.h. 
Unit of measure Value  Test method 
kV/mm  ≥150 DIN 46448