SynChem – Resins & Varnishes WEVOSIL 26040 FL

Solvent-free, two-component silicone-based gap filler with high thermal conductivity .

The resulting soft-elastic moulding material is characterized by good low-temperature flexibility and excellent behaviour in the temperature shock test. The system contains mineral fillers, which can be abrasive.

Recommended temperature range: -60 °C to +200 °C.

The resin is processed together with WEVOSIL 26040 FL B.

Download datasheet

Application

  • Pressure-sensitive electrical components
  • Complete assemblies in SMD technology
  • Thermally conductive adhesive and encapsulation

Standards

  • Temperature application range -60 °C - +200 °C

Delivery forms

30 kg containers

Color

WEVOSIL 26040 FL A: Natural
WEVOSIL 26040 FL B: Blue

Storage

Polymer (A-component) and crosslinker (B-component) must be stored dry and at a temperature of 5 °C to 30 °C and not in the open air. The containers should be stored upright and not
directly on the cold floor (floor temperature not below 5 °C). WEVOSIL 26040 has a shelf life of 6 months after production.

At temperatures above 25 °C, the settling of the fillers contained in the casting compound is accelerated. The potting compound is then more difficult to homogenize.

 

Hardening

  • Pot life: 50-70 minutes at room temperature, depending on layer thickness and casting volume.
  • Curing time: 4 hours at room temperature, or 1 hour at 100 °C
  • Final chemical curing: several days at room temperature

Curing notes:

  • Excessive humidity has a damaging effect on the uncured compound. If necessary, curing should take place in an air-conditioned room, a container with low humidity or in an oven.
  • Curing at an elevated temperature (50 - 100°C) accelerates the curing reaction and can influence the adhesion of the potting compound to the walls of the component.
  • The WEVOSIL 26040 FL casting compound reaches its final hardness after a few days at room temperature.
  • After approx. 4 hours curing at room temperature (or 1 h @ 100 °C) approx. 90 - 95 % of the curing takes place. To achieve the final hardness, post-curing can then be carried out for 2 hours at 165 - 180 °C. However, this last step is not absolutely necessary. After a few days, the casting compound reaches its final hardness even at room temperature (depending on the system).
  • Electrical tests of the component quality can usually be carried out after the first curing (4 hours at room temperature or 1 h @ 100 °C).

Protection

Our products are intended exclusively for industrial use. For further details, please read the safety data sheet.

Processing

Our processing instructions please find here.

 

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Technical data

General
Property Unit of measure Condition Value Test method
Mixing ratio Gew-% 100:100
Pot lilfe min 25 °C 50-70
Curing time h 25 °C 4
Curing time h 100 °C 1
Mechanical
Property Unit of measure Condition Value Test method
Density g/cm³ WEVOSIL 26040 FL A 3.08-3.12
Density g/cm³ WEVOSIL 26040 FL B 3.08-3.12
Viscosity mPas WEVOSIL 26040 FL B / 22 °C 100,000-150,000
Viscosity mPas 22 °C, WEVOSIL 26040 FL A 100,000-150,000
Mixture viscosity 22 °C 100,000-150,000
Hardness Shore 00 60-80 ISO 48-4
Water absorption % 30 d, RT 0.1
Elongation at break % 30 ISO 527-2
Thermal
Property Unit of measure Condition Value Test method
Glass transition temperature °C -100 TMA
Thermal conductivity W/m*K 4.0 ISO 22007-2:2008
Electrical
Property Unit of measure Condition Value Test method
Dielectric strength kV/mm >20 DIN EN 60243
Dielectric constant ε at 50 Hz, 23 °C 7.0 DIN EN 60250
Dielectric constant; at 1 kHz, 23 °C 6.78 DIN EN 60250
Dielectric constant ε at 1 MHz, 23 °C 6.51 DIN EN 60250
Volume resistance specific at 23 °C, 50 % r.h. Ωxcm >10^13 DIN EN 62631-3-1:2016
Surface resistivity at 23°C and 50 % r.h. >10^14 DIN EN 62631-3-2:2016