SynChem – Resins & Varnishes Dolphon® XL-2103 1K Resin

Dolphon® XL-2103 is a slightly thixotropic, 1K resin based on polyester.

Dolphon® XL-2103 is characterised by the following properties:

  • UL approved
  • excellent wetting properties
  • good bond strength
  • very low weight loss on cure
  • very low odour
  • fast cure cycles
Download datasheet

Application

Dolphon® XL-2103 is suitable for impregnation of:

  • stators
  • rotors
  • traction coils
  • transformers
  • inductances
  • other devices

Standards

  • UL-approved class H (180 °C), File Number OBOR2.E 317427 + File OBJS.2 E317429
  • UL-System-approved from 130 - 220 °C
  • UL-approvement:

Temperature Class acc. UL 1446:

NEMA - MW-16 Twisted Pair 220 °C
NEMA - MW-35 Twisted Pair 200 °C

 

 

RoHS-compliant 2011/65/EU
REACh-compliant 2006/121/EU

Delivery forms

Dolphon® XL-2103 is delivered in 25 kg disposable containers, 230 kg barrels and 1000 kg containers.

Storage

Dolphon® XL -2103 can be stored for 12 months at room temperature in a sealed container (max. 30 °C). The dip resin must be stored in a cool place and protected against direct sunlight, UV radiation and sources of heat. The storage life of the dip resin can be extended indefinitely by adding fresh resin to the dipping bath during processing. It is recommended to send a 300 g sample to our laboratory every 6 months for a vscosity and gel-time control.

Hardening

Curing is possible in a closed oven with or without preheating.
The curing time commences once the object temperature has been reached.

Typical curing times:
150 °C - 1 h*
130 °C - 3-4 h*

*(Full curing is measured by DSC. Time must be taken after units reach the baking temperature.) For objects having to endure high mechanical or chemical stress during service, longer curing times are recommended.
 

Processing

Dolphon® XL-2103 can be applied both under vacuum and in open dip tanks at atmospheric pressure. For application in open dip tanks or with conveyor systems the following cycle is suggested:

1. Preheat the units at 50-60 °C (max.)
2. Dip into the resin for 30-60'
3. Drain for 1h min.
4. Bake min. 3-4h at 130 °C or 1h at 150 °C* (see curing)

For the VPI application the cycle must be set for each type of machines. Feel free to contact us.

Technical data

Mechanical
Property Unit of measure Conditions  Values  Test method 
Heat conductivity  W/mK    0.25 - 0.30  
Weight loss  10 g cured 1 h at 150 °C < 3.5  
Bond strength  25 °C >180 ASTM D-2519 Helical Coil
Bond strength  80 °C >90  
Bond strength  155 °C >30 ASTM D-2519 Helical Coil
Thermal
Property Value 
Thermal class  H (180 °C)
Liquid phase
Property Unit of measure Conditions  Values  Test method 
Specific density  g/l  at 25 °C 1,150 ± 30  
Viscosity  cps  at 25 °C 2500-3000 Brookfield
Viscosity  at 25 °C 30 - 40 Ford Cup 8
Gel time  min  at 110 °C 25-40  
Electrical
Property Unit of measure Conditions  Values  Test method 
Dielectric strength  kV/mm  0.025 mm film > 128 ASTM D-115
Volume resistivity  Ω x cm    >10^15 IEC 60464-2
Volume resistivity  Ω x cm  after 7 d water storage >10^12 IEC 60464-2
Surface resistivity  Ω    >10^15 IEC 60464-2
Dielectric constant    at 25 °C 3.1 ASTM D-150
Creep resistance    CTI 600 M IEC 60112