SynChem – Resins & Varnishes Damisol® 3630 HTP 02/300 1-component-resin
Damisol® 3630 HTP 02/100 is an opaque, solvent-free 1-component-resin based on unsaturated polyesterimides.
The thixotrop Damisol® 3630 HTP 02/100 has the following properties:
- no VOC (Volatile Oganic Compound)
- very low smell
- high reactivity
- high stability in tank
- low viscosity
Cured Damisol® 3630 HTP 02/100 has the following properties:
- outstanding thermal resistance up to (and more than) Class H.
Application
Damisol® 3630 HTP 02/100 is suitable for 3.3. kV machines using right porous mica polyester film based tape as main wall insulation, like Samicapor 315.45. Dipping, VPI, trickling and Roll-Dipping of all kinds of windings, from any low and medium voltage machines and transformers.
Standards
- UL-approved Class 180 (H)
- UL-File-no. E 98511
- RoHS-compliant acc. 2011/65/EU
- VOC-free, 1999/13/EC
Delivery forms
Damisol® 3630 HTP 02/100 is available in:
- 20 kg cans
- 200 kg drums
- 1000 kg container
Storage
Damisol® 3630 HTP 02/100 can be stored 12 months at max. 25 °C in sealed containers and must be protected from light and sun. Higher temperature can be reached during short period of time. If storing the resin in a supply tank, it is recommended keeping the resin under atmospheric pressure.
Hardening
Recommended curing time:
- Trickling: at 150 °C - 30-60 min.
- Dipping and VPI: at 150 °C - 2 h
Protection
Please refer to the material safety data sheet for complete information.
Processing
The Damisol® 3630 HTP 02/100 can be precessed in any kind of dipping, VPI; trickling or Dip-Rolling machines, in immersion and vacuum or vacuum pressure installations. If storing the resin in a supply tank, we recommend keeping the resin under atmospheric pressure. It is advantageous not to fill the supply tank completely. The recommended filling level is 70 %.
Using hot impregnating process, the resin temperature should be maintainedlower than 30 °C and refreshed with new resin.
Technical data
Property | Unit of measure | Conditions | Value | Test method |
---|---|---|---|---|
Bond strength | daN | 23 °C | 25 | IEC 61033 |
Bond strength | daN | 155 °C | 8 | IEC 61033 |
Bond strength | daN | 180 °C | 6 | IEC 61033 |
Property | Unit of measure | Value |
---|---|---|
Thermal class | °C | 180 |
Property | Unit of measure | Conditions | Value | Test method |
---|---|---|---|---|
Resistance | % | 2 % sodium hydroxide | <0.1 | ISO 175 |
Resistance | % | 10 % hydrogen chloride | <0.7 | ISO 175 |
Property | Unit of measure | Conditions | Value | Test method |
---|---|---|---|---|
Flashpoint | °C | >100 | ISO 3679 | |
Gel time at 120 °C | min | 3-6 | ||
Density | g/cm³ | at 23 °C | 1.10 | |
Viscosity | mPas | 23 °C / 2.5 rpm | 250-350 | Brookfield/ISO 2555 |
Property | Unit of measure | Value | Test method |
---|---|---|---|
Dielectric strength at 23 °C and 50 % r.h. | kV/mm | ≥150 | DIN 46448 |