SynChem – Resins & Varnishes WEVOPUR 552 FL PU encapsulating system
Two-component encapsulating system based on polyurethane.
The resin component contains a mineral filler providing the material with self-extinguish properties. The resin contains no halogenated flame-retardants and is tough elastic. WEVOPUR 552 FL ist used with WEVONAT 300.
Temperature range of use: -40 °C to +130 °C.
Application
Encapsulation of electrical components like transformers, sensors, capacitors or PCBs.
Standards
Class B
RTI 130 °C
UL 94 V 0 (1.5 mm)
UL File No. E 108835
Colours:
WEVOPUR 552 FL: black (standard) or by choice
WEVONAT 300: dark brown
Delivery forms
30 kg metal containers and 250 kg barrel.
Anmerkungen
Technical data and processing instructions you will receive on request.
Storage
- In closed original container and dry storage between 15 °C and 25 °C, 6 months.
- Store resin (A component, polyol) and hardener (B component, Isocyanat) dry and at temperatures between 15 °C and 25 °C. Store on pallets or collecting tray and do not expose to draft.
- At temperatures below 15 °C the hardener can crystallise which can be seen by opacity and/or clumps/crystals (usually hardeners are clear, transparent liquids in spite of their dark brown colour). In this case the hardener should not be used anymore.
- At temperatures higher then 25 °C the sedimentation of fillers contained in the resin component is accelerated. As a consequence it is more difficult to prepare (stir) the resin.
Hardening
Pot life: 30 - 50 min at room temperature, depending on coat thickness and pouring volume.
Curing time: 12 - 24 h at room temperature
Complete chemical curing: 10 - 14 days at room temperature
- High air moisture may lead to forming of bubbles. Reference value: the rel. air humidity should not exceed 40 - 60 %, depending on the product.To avoid a reaction of the surface curing should be in an air conditioned room, a container with low air moisture or in an oven.
- Elevated temperatures accelerate the curing. Curing temperature should not exceed 80 °C to avoid tensions of the resin.
- Final hardness of WEVOPUR 552 FL will be attained after 7 – 14 days at room temperature.
- This process can be accelerated by post curing at 60 - 80 °C for 16 - 24 h. This is relevant for potted components subjec to qualification tests.
- Electrical tests can usually be carried out straight after potting.
Protection
Observe the common protective measures acc. to EG safety data sheets and the data sheet M044 of the German Chemical Industry Association (BG Chemie) when using the liquid resin.
Cleaning
Since the cured resin is practically insoluble, tools and equipment have to be cleaned in sufficient time.
Processing
Our processing instructions please find here.
You have questions according to our resins and varnishes or want to send an inquiry?
Our product manager will be happy to help you.
Technical data
| Property | Unit of measure | Values | Test method |
|---|---|---|---|
| Shore-D-hardness | 60-70 | acc. to ISO 7619-1 | |
| Tensile strength | N/mm² | 6 | ISO 527-2 |
| Elongation at break | % | 62 | ISO 527-2 |
| E module | N/mm² | 55 | ISO 527-2 |
| Water absorption | % | 0.4 | after 30 d immersion |
| Property | Unit of measure | Condition | Values | Test method |
|---|---|---|---|---|
| Thermal conductivity | W/m*K | 0.61 | ISO 22007-2:2008 | |
| Glass transition temperature | °C | 15 | TMA | |
| Coefficient of expansion | ppm/K | <10 °C | 58 | TMA |
| Coeficient of expansion | ppm/K | >20 °C | 142 | TMA |
| Thermal class | B | IEC 60085 | ||
| Curing shrinkage | % | 1 | ||
| Burning behaviour | 1.5 mm | V-0 | UL 94 |
| Property | Unit of measure | Values | Test method |
|---|---|---|---|
| Dielectric strength | kV/mm | 29 | DIN EN 60243 |
| Volume resistance specific at 23 °C, 50 % r.h. | Ωxcm | 10^13 | DIN EN 62631-3-1:2016 |
| Surface resistivity at 23°C and 50 % r.h. | Ω | 10^16 | DIN EN 62631-3-1:2016 |
| Dielectric constant ε at 50 Hz, 23 °C | 5.6 | DIN EN 60250 | |
| Dielectric constant; at 1 kHz, 23 °C | 4.6 | DIN EN 60250 | |
| Dielectric constant ε at 1 MHz, 23 °C | 3.7 | DIN EN 60250 | |
| Dielectric loss factor at (AC, 23 °C, 50 Hz) | 0.117 | DIN EN 60250 | |
| Dielectric loss factor tan б at 1 kHz, 23 °C | 0.0842 | DIN EN 60250 | |
| Dielectric loss factor tan б at 1 MHz, 23 °C | 0.038 | DIN EN 60250 | |
| Creep resistance | CTI 600-0.1 | DIN EN 60112 |
| Property | Unit of measure | Condition | Values | Test method |
|---|---|---|---|---|
| Glowing wire test | °C | 3.5 mm | 960 | DIN EN 60695-2-11:2014-11 |
| Property | Unit of measure | WEVOPUR 552 FL | WEVONAT 300 | Resin-/hardener mixture |
|---|---|---|---|---|
| Mixing ratio | weight-% | 100 | 20 | |
| Viscosity (22 °C) | mPas | 6,000-7,000 | 70-120 | 1,000-1,600 |
| Density (22 °C) | g/cm³ | 1.55-1.60 | 1.20-1.24 |