SynChem – Resins & Varnishes WEVOPUR 7210 FL PU encapsulating system
Two-component encapsulating system based on polyurethane.
The resin component contains a mineral filler providing the material with self-extinguish properties. The resin contains no halogenated flame-retardants. The cured polymer exhibits tough properties. The product processes a high thermal distortion temperature.
Temperature range of use: -40 °C to +145 °C
Wevopur 7210 FL is used with hardener WEVONAT 507.
Application
Encapsulation of electrical components for medium and high voltage applications.
Standards
- Class B
- UL 94 V 0 (6 mm)
- UL File E 108835
Delivery forms
30 kg metal container and 250 kg barrel.
Color
WEVOPUR 7210 FL: black (standard)
WEVONAT 507: brown
Storage
6 months in closed containers, dry storage at 15 to 25 °C.
Store resin (A component, polyol) and hardener (B component, Isocyanat) dry and at temperatures between 15 °C and 25 °C. Store on pallets or collecting tray and do not expose to draft. At temperatures below 15 °C the hardener can crystallise which can be seen by opacity and/or clumps/crystals (usually hardeners are clear, transparent liquids in spite of their dark brown colour). In this case the hardener should not be used anymore. At temperatures higher then 25 °C the sedimentation of fillers contained in the resin component is accelerated. As a consequence it is more difficult to prepare (stir) the resin.
Hardening
- Pot life: 20-35 min at room temperature, depending on coat thickness and pouring volume.
- Curing time: 12-24 h at room temperature.
- Complete chemical curing: 10-14 days at room temperature
- High air moisture may lead to forming of bubbles. Reference value: the rel. air humidity should not exceed 40-60 %, depending on the product.To avoid a reaction of the surface curing should be in an air conditioned room, a container with low air moisture or in an oven. Elevated temperatures accelerate the curing. Curing temperature should not exceed 80 °C to avoid tensions of the resin.
- Final hardness of WEVOPUR 7210 FL will be attained after 7–14 days at room temperature. This process can be accelerated by post curing at 60-80 °C for 16-24 h. This is relevant for potted components subjec to qualification tests. Electrical tests can usually be carried out straight after potting.
Protection
Observe the common protective measures acc. to EG safety data sheets and the data sheet M044 of the German Chemical Industry Association (BG Chemie) when using the liquid resin.
Cleaning
Since the cured resin is practically insoluble, tools and equipment have to be cleaned in sufficient time.
Processing
Our processing instructions please find here.
You have questions according to our resins and varnishes or want to send an inquiry?
Our product manager will be happy to help you.
Technical data
| Property | Unit of measure | Values | Test method |
|---|---|---|---|
| Shore-D-hardness | 85-90 | DIN ISO 48-4:2011-02 | |
| Tensile strength | N/mm² | 54 | ISO 527-2:2012-06 |
| Elongation at break | % | 2 | ISO 527-2:2012-06 |
| E module | N/mm² | 5500 | ISO 527-2:2012-06 |
| Property | Unit of measure | Condition | Values | Test method |
|---|---|---|---|---|
| Thermal conductivity | W/m*K | 0.55 | DIN 22007-2:2008 | |
| Glass transition temperature | °C | 85 | TMA ISO 11359-2:2021-11 | |
| Coefficient of expansion | ppm/K | <70 | 54 | TMA ISO 11359-2:2021-11 |
| Coeficient of expansion | ppm/K | >100 | 151 | TMA ISO 11359-2:2021-11 |
| Thermal class | B | DIN EN 60085 |
| Property | Unit of measure | Condition | Values | Test method |
|---|---|---|---|---|
| Water absorption | % | after 30 days storage | 0.3 | |
| Burning behavior | 6 mm | V-0 | UL 94 |
| Property | Unit of measure | Condition | Values | Test method |
|---|---|---|---|---|
| Dielectric strength | kV/mm | 34 | IEC 60243 | |
| Specific volume resistance | Ω*cm | at 23 °C / 50 % RH | 10^14 | DIN EN 62631-3-1:2016 |
| Surface resistivity | Ω | at 23 °C / 50 % r.H. | 10^17 | DIN EN 62631-3-1:2016 |
| Dielectric constant (AC, 23 °C, 50 Hz) | 3.7 | IEC 62631-2-1:2018-12 | ||
| Dielectric constant; at 1 kHz, 23 °C | 3.6 | IEC 62631-2-1:2018-12 | ||
| Dielectric constant ε at 1 MHz, 23 °C | 3.5 | IEC 62631-2-1:2018-12 | ||
| Dielectric loss factor at (AC, 23 °C, 50 Hz) | 0.01 | IEC 62631-2-1:2018-12 | ||
| Dielectric loss factor tan б at 1 kHz, 23 °C | 0.007 | IEC 62631-2-1:2018-12 | ||
| Dielectric loss factor tan б at 1 MHz, 23 °C | 0.014 | IEC 62631-2-1:2018-12 | ||
| Creep resistance | CTI 600 | DIN EN 60112 |
| Property | Unit of measure | Condition | Values | Test method |
|---|---|---|---|---|
| Glowing wire test | °C | 6 mm | 960 / 825 | IEC 60695-2-12/-13, GWFI/GWIT |
| Property | Unit of measure | WEVOPUR 7210 FL | WEVONAT 507 | Resin-/hardener-mixture | Test method |
|---|---|---|---|---|---|
| Mixing ratio | weight-% | 100 | 43 | ||
| Viscosity (22 °C) | mPas | 7,000-8,500 | 10-40 | 400-600 | |
| Density (22 °C) | g/cm³ | 1.53-1.57 | 1.20-1.24 |