Heat class
Type
Backing / Material
Properties
Product Heat class Type Backing / Material Properties
SHSold® V155 F / 155 °C Round wire Copper directly solderable
SHTherm® V180 H / 180 °C Round wire Copper directly solderable
SHSold® V180 H / 180 °C Round wire Copper directly solderable
SHTherm® 200 H / 180 °C Round wire Copper
SHTherm® 210 N / 200 °C Round wire Copper
SHTherm® 220 R / 220 °C Round wire Copper
SHTherm® 210 Flat N / 200 °C Flat wire Copper
SHBond® WD210 N / 200 °C Round wire Copper bondable
SHTherm® 210 Alu N / 200 °C Round wire Aluminium
SHTherm® 210 Glide N / 200 °C Round wire Copper self lubricating
SHTherm® 210 Flat Alu N / 200 °C Flat wire Aluminium
SHSold® V180 Glide H / 180 °C Round wire Copper directly solderable, self lubricating
SHTherm® 210 TE N / 200 °C Round wire Copper partial discharge resistant
SHTherm® 220 Glide R / 220 °C Round wire Copper self lubricating
SHTherm® 220 Flat R / 220 °C Flat wire Copper
SHBond® WD210 Glide N / 200 °C Round wire Copper bondable, self lubricating
SHBond® WD210 Alu N / 200 °C Round wire Aluminium bondable